heat sink×モメンティブ・テクノロジーズ・ジャパン - List of Manufacturers, Suppliers, Companies and Products

Composite heat sink

Composite heat sink optimized for thermal expansion with thermal conductivity of 1000 W/mK.

This is a super high thermal conductivity heat sink that combines core material TPG with a thermal conductivity of 1500 W/mK and capsule material optimized for thermal expansion. It is suitable for packaging high-power, high-frequency semiconductor chips.

• Company：モメンティブ・テクノロジーズ・ジャパン
• Price：Other

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